Topping out ceremony for the Centre for Advancing Electronics Dresden (cfaed) at the Technical University of Dresden
After a construction period of around one year, the topping-out ceremony for the construction of the Centre for Advancing Electronics Dresden (cfaed) at the Technical University of Dresden was celebrated on 21 October 2016 with the attendance of the Saxon Minister of Science, Dr. Eva-Maria Stange.
After a construction period of around one year, the topping-out ceremony for the construction of the Centre for Advancing Electronics Dresden (cfaed) at the Technical University of Dresden was celebrated on 21 October 2016 with the attendance of the Saxon Minister of Science, Dr. Eva-Maria Stange.
The cfaed is housed in a replacement building of a wing of the Barkhausen building and an additional new building in the inner courtyard, as well as in renovated and upgraded areas in the existing building. The measure will create the necessary and appropriate framework conditions to drive research on particularly energy-efficient circuits, next generation radio transmission systems, and semiconductor technology of smaller size, higher speed and lower power consumption. For this purpose, an electron microscope of nanotechnology will be developed especially for future-oriented research. This microscope will have the highest requirements for vibration-free construction as well as thermals and acoustics.
With a construction cost of around 36.45 million euros, 5,100 m² of usable floor space will be created, which will integrate around 1,230 m² of testing and laboratory areas. With the handover to the Technical University of Dresden at the end of 2017, the first cluster of excellence will be completed by the excellence initiative of the German federal and regional governments, and interdisciplinary research will be started. The project is also funded by the European Regional Development Fund (ERDF).
KREBS+KIEFER is providing the project with services for structural planning, thermal structural physics, building acoustics and spatial acoustics.